Klagenfurt, Graz, Austria – June 19th, 2018 – CISC Semiconductor GmbH is pleased to announce a new joint funded project under the umbrella of the Electronic Component Systems for European Leadership (ECSEL) Joint Undertaking. CISC’s planned R&D investment of 800.000 $ is focussed on integration of enhanced chipsets providing multiple secure elements, thus allowing enhanced services and security on gateways for vehicles. This will enable in future also 3rd party applications executing in a secure environment on the vehicle gateway to apply restricted access to users, maintenance staff and provide a platform for new mobility services for the connected car.

The full press release of the project launch is available for download: CISC SECREDAS Press Release (EN).